TBS20S

TBS20S is a thermal bonding system. It is a two part epoxy bonding system which utilises metal oxides to provide excellent thermal conductivity whilst being electrically insulating. It is especially useful in the manufacture of heatsink assemblies where ‘piggy back’ arrangements are applied and where the manufacture design of heat sinks does not allow for welding or brazing techniques to be employed due to complexity or geometry of the fins. TBS is also ideal for use as a bonding medium in surface mounting assemblies.

• 36 months shelf life
• 20ml (two syringes)
• High bond strength and excellent adhesion provides an alternative to welding techniques
• Very good thermal conductivity, optimum efficiency of heat dissipation
• Contains solid glass spheres, aids application by controlling the correct coating thickness
• Room temperature curing, simple mixing and curing procedures for ease of use
• Blue colour (part A) and cream colour (part B)
• Viscosity of 70-80(Pa s) at 1rpm, 1.85g/ml cured density, 2200N/cm² tensile strength
• Operating temperature range from -40°C to + 120°C
• Electric strength of 11 to 12KV/mm